ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,928, issued on July 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor device and manufacturing method thereof" was invented by Shu-Shen Yeh (Taoyuan, Taiwan), Po-Yao Lin (Hsinchu County, Taiwan), Hui-Chang Yu (Hsinchu County, Taiwan), Shyue-Ter Leu (Hsinchu, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first semiconductor die, a second semiconductor die and a package lid. The package lid is disposed over the first semiconductor die and the second semiconductor die. The package lid includes a roof and an island. The roof extend...