ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,927, issued on July 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor device" was invented by Wensen Hung (Hsinchu County, Taiwan), Yih-Ting Shen (Changhua County, Taiwan), Jia-Syuan Li (Taoyuan, Taiwan) and Tsung-Yu Chen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device including a package, a lid and a thermal interface material is provided. The package includes a packaging substrate, semiconductor dies and an insulating encapsulation, wherein the semiconductor dies are disposed on and electrically connected to the packaging substrate, and the insulating encapsulatio...