US Patent Issued to Taiwan Semiconductor Manufacturing on July 8 for "Redistribution layer structure with support features and methods" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,940, issued on July 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Redistribution layer structure with support features and methods" was invented by Monsen Liu (Hsinchu, Taiwan), Shang-Lun Tsai (Hsinchu, Taiwan), Shuo-Mao Chen (Hsinchu, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a semiconductor chip and a redistribution layer (RDL) structure connected to the semiconductor chip. The redistribution layer structure comprises a first region including: a first bump connected to the semiconductor chip; a second bump; and a plurality of first redistribution ...