US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 8 for "Redistribution layer features" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,959, issued on July 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Redistribution layer features" was invented by Wen-Chun Wang (Taichung, Taiwan), Tzy-Kuang Lee (Taichung, Taiwan), Chih-Hsien Lin (Tainan, Taiwan), Ching-Hung Kao (Tainan, Taiwan) and Yen-Yu Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor structures and method of forming the same are provided. A semiconductor structure according to the present disclosure includes a contact feature in a dielectric layer, a passivation structure over the dielectric layer, a conductive feature over the passivation structure, a se...