US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 8 for "Package structure with conductive via structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,989, issued on July 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Package structure with conductive via structure" was invented by Meng-Liang Lin (Hsinchu, Taiwan), Po-Yao Chuang (Hsin-Chu, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes an interposer substrate including an insulating structure, a conductive pad, a first conductive line, and a first conductive via structure. The package structure includes an electronic device bonded to the conductive pad. The package structure includes a chip structure bon...