US Patent Issued to Taiwan Semiconductor Manufacturing on July 8 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,929, issued on July 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and manufacturing method thereof" was invented by Kai-Fung Chang (Taipei, Taiwan), Sheng-Feng Weng (Taichung, Taiwan), Ming-Yu Yen (MiaoLi County, Taiwan), Wei-Jhan Tsai (Kaohsiung, Taiwan), Chao-Wei Chiu (Hsinchu, Taiwan), Chao-Wei Li (Hsinchu, Taiwan), Chih-Wei Lin (Hsinchu County, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure including a semiconductor die, an encapsulant, a redistribution structure, and a through insulating via is provided. The first redistributio...