ALEXANDRIA, Va., July 9 -- United States Patent no. 12,355,007, issued on July 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package and method of fabricating the same" was invented by Hsien-Wei Chen (Hsinchu, Taiwan) and Ming-Fa Chen (Taichung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Packages and methods of fabricating the same are provided. The package includes a first die, wherein the first die includes a plurality of through vias from a first surface of the first die toward a second surface of the first die; a second die disposed below the first die, wherein the second surface of the first die is bonded to the second die; an isolation layer disposed in t...