US Patent Issued to Taiwan Semiconductor Manufacturing on July 8 for "Package, optical device, and manufacturing method of package" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,353,008, issued on July 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package, optical device, and manufacturing method of package" was invented by Hsien-Wei Chen (Hsinchu, Taiwan) and Ming-Fa Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a photonic integrated circuit die and an electric integrated circuit die. The photonic integrated circuit die includes a substrate and a waveguide. The substrate has a notch and the notch is occupied by air. The waveguide is disposed over the substrate. In a top view, a first portion of the waveguide is overlapped with the substrate and a se...