US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 8 for "Method of manufacturing semiconductor devices and pattern formation method" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,874, issued on July 8, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of manufacturing semiconductor devices and pattern formation method" was invented by An-Ren Zi (Hsinchu, Taiwan), Chun-Chih Ho (Taichung, Taiwan), Yahru Cheng (Taipei, Taiwan) and Ching-Yu Chang (Yuansun Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of manufacturing a semiconductor device, a metallic photoresist layer is formed over a target layer to be patterned, the metallic photoresist layer is selectively exposed to actinic radiation to form a latent pattern, and the latent pattern is developed by applying...