ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,884, issued on July 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Method for making a packaging substrate" was invented by Kuo-Ching Hsu (Chung-Ho, Taiwan) and Shyue-Ter Leu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A packaging substrate fabrication process is provided. A substrate plate including through-plate metal via structures is provided. At least one interconnect-level structure may be formed by performing a unit sequence of processing steps that includes: a metal seed deposition step; a first masking step; a first electroplating step that forms metal lines; a second masking step; a se...