US Patent Issued to Taiwan Semiconductor Manufacturing on July 8 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,924, issued on July 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Chien-Hsun Chen (Zhutian Township, Taiwan), Yu-Ling Tsai (Hsinchu, Taiwan), Jiun Yi Wu (Zhongli, Taiwan), Chien-Hsun Lee (Chu-tung Town, Taiwan) and Chung-Shi Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: a first integrated circuit die having a first contact region and a first non-contact region; an encapsulant contacting sides of the first integrated circuit die; a dielectric layer contacting the encapsulant and the first integrated cir...