US Patent Issued to Taiwan Semiconductor Manufacturing on July 8 for "Electronic assembly having circuit carrier" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,356,558, issued on July 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Electronic assembly having circuit carrier" was invented by Jiun-Yi Wu (Taoyuan, Taiwan), Chien-Hsun Lee (Hsin-chu County, Taiwan), Chen-Hua Yu (Hsinchu, Taiwan) and Chung-Shi Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic assembly includes a first wafer including a stack of alternating first dielectric layers and first circuit layers, a flexible structure including a second dielectric layer and a second circuit layer covered by the second dielectric layer, and a second wafer stacked upon the first wafer and includ...