US Patent Issued to Taiwan Semiconductor Manufacturing on July 8 for "Delamination control of dielectric layers of integrated circuit chips" (Taiwanese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,946, issued on July 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd..

"Delamination control of dielectric layers of integrated circuit chips" was invented by Jun He (Zhubei, Taiwan), Li-Hsien Huang (Zhubei, Taiwan), Yao-Chun Chuang (Hsinchu, Taiwan), Chih-Lin Wang (Zhubei, Taiwan) and Shih-Kang Tien (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package and a method of fabricating the same are disclosed. The chip package includes a substrate with a first region, a second region surrounding the first region, and a third region surrounding the second region, a device layer disposed on the substrate, a via layer dis...