ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,651, issued on July 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Wafer bonding method" was invented by Yung-Chi Lin (Su-Lin, Taiwan), Tsang-Jiuh Wu (Hsinchu, Taiwan), Wen-Chih Chiou (Zhunan Township, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: a first wafer including a first substrate and a first interconnect structure, a sidewall of the first interconnect structure forming an obtuse angle with a sidewall of the first substrate; and a second wafer bonded to the first wafer, the second wafer including a second substrate and a second...