US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 29 for "Test structure and test method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,590, issued on July 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Test structure and test method thereof" was invented by Jing-Yi Lin (Taipei, Taiwan), Chih-Chuan Yang (Tainan, Taiwan), Kuo-Hsiu Hsu (Taoyuan, Taiwan) and Lien-Jung Hung (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A test structure on a wafer is provided. The test structure includes a plurality of cells under test, a plurality of first input pads, and a plurality of second input pads. The cells are arranged in rows and columns of a test array. Each of the first input pads is coupled to the cells in respective column of the te...