US Patent Issued to Taiwan Semiconductor Manufacturing on July 29 for "Semiconductor package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,596, issued on July 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and manufacturing method thereof" was invented by Wei-Ming Wang (Taichung, Taiwan), Yu-Hung Lin (Taichung, Taiwan) and Shih-Peng Tai (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor die, a semiconductor frame structure, a semiconductor cover structure and conductive balls. The substrate has a ground plate embedded therein. The semiconductor die is disposed on the substr...