US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 29 for "Semiconductor device package with stress reduction design" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,636, issued on July 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device package with stress reduction design" was invented by Shu-Shen Yeh (Taoyuan, Taiwan), Chin-Hua Wang (New Taipei, Taiwan), Po-Chen Lai (Hsinchu County, Taiwan), Po-Yao Lin (Hsinchu County, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package is provided, including a substrate, a semiconductor device, a ring structure, a lid structure, and at least one adhesive member. The semiconductor device is disposed over the substrate. The ring structure is disposed ov...