US Patent Issued to Taiwan Semiconductor Manufacturing on July 29 for "Semiconductor device and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,366, issued on July 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of manufacturing the same" was invented by Kuan-Ting Pan (Taipei, Taiwan), Chih-Hao Wang (Hsinchu County, Taiwan), Kuo-Cheng Chiang (Hsinchu County, Taiwan), Yi-Bo Liao (Hsinchu, Taiwan) and Yi-Ruei Jhan (Keelung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor substrate, a first semiconductor stack, a second semiconductor stack, a first gate structure, and a second gate structure. The semiconductor substrate comprising a first device region and a second device r...