US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 29 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,298, issued on July 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Chen-Chin Liu (Hsinchu, Taiwan), Wei Cheng Wu (Zhubei, Taiwan), Yi Hsien Lu (Yuanchang Township, Taiwan), Yu-Hsiung Wang (Zhubei, Taiwan) and Juo-Li Yang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of manufacturing a semiconductor device, a memory cell structure covered by a protective layer is formed in a memory cell area of a substrate. A mask pattern is formed. The mask pattern has an opening over a first circuit area, while the mem...