US Patent Issued to Taiwan Semiconductor Manufacturing on July 29 for "Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,652, issued on July 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices" was invented by Ching-Jung Yang (Pingzhen, Taiwan) and Yen-Ping Wang (Hemei Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Packages for semiconductor devices, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, a package for a semiconductor device includes an integrated circuit die mounting region, a molding material around the integrated circuit die mou...