US Patent Issued to Taiwan Semiconductor Manufacturing on July 29 for "Package system and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,595, issued on July 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package system and manufacturing method thereof" was invented by Pei-Hsuan Lee (Tainan, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan) and Chien-Ling Hwang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a package system includes: providing a base plate with a first thermal interface material (TIM) layer; placing a semiconductor package on the first TIM layer over the base plate, wherein the semiconductor package comprises a plurality of packaging units arranged in an array and a plurality of electrical connec...