US Patent Issued to Taiwan Semiconductor Manufacturing on July 29 for "Package structure comprising a semiconductor die with thermoelectric elements and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,599, issued on July 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure comprising a semiconductor die with thermoelectric elements and manufacturing method thereof" was invented by Cheng-Yen Hsieh (Hsinchu, Taiwan), Chih-Horng Chang (Taipei, Taiwan) and Chung-Yu Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a semiconductor die and a thermoelectric structure disposed on the semiconductor die. The thermoelectric structure includes P-type semiconductor blocks, N-type semiconductor blocks and metal pads. The P-type semi...