US Patent Issued to Taiwan Semiconductor Manufacturing on July 29 for "Non-DMSO stripper for advance package metal plating process" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,639, issued on July 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Non-DMSO stripper for advance package metal plating process" was invented by Tzu-Yang Lin (Hsinchu, Taiwan), Chen-Yu Liu (Hsinchu, Taiwan), Yung-Han Chuang (Hsinchu, Taiwan), Ming-Da Cheng (Hsinchu, Taiwan) and Ching-Yu Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a semiconductor structure is provided. The method includes forming a patterned photoresist layer over a substrate and removing the patterned photoresist layer using a photoresist stripping composition that is free of dimethyl sulfoxide. The p...