US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 29 for "Methods of forming optical modules" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,401, issued on July 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Methods of forming optical modules" was invented by Jung-Huei Peng (Hsinchu, Taiwan), Chun-Wen Cheng (Hsinchu County, Taiwan) and Yi-Chien Wu (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Optical modules and methods of forming the same are provided. In an embodiment, an exemplary method includes forming multiple first optical elements over a first wafer, forming multiple second optical elements over a second wafer, forming multiple third optical elements over a third wafer, aligning the first wafer with the second wafer such...