US Patent Issued to Taiwan Semiconductor Manufacturing on July 29 for "Method of forming package structure by using a wafer chuck with adjustable curved surface" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,655, issued on July 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of forming package structure by using a wafer chuck with adjustable curved surface" was invented by Wen-Chih Chiou (Miaoli County, Taiwan), Yung-Chi Lin (New Taipei, Taiwan) and Yen-Ming Chen (Hsin-Chu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes attaching a wafer to a wafer chuck having a curved surface. The method further includes placing a device die on the wafer, such that a first dielectric layer of the device die is in contact with a second dielectric layer of the wafer, and performing an annealing p...