US Patent Issued to Taiwan Semiconductor Manufacturing on July 29 for "Method of fabricating semiconductor structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,627, issued on July 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method of fabricating semiconductor structure" was invented by Tzu-Sung Huang (Tainan, Taiwan), Cheng-Chieh Hsieh (Tainan, Taiwan), Hsiu-Jen Lin (Hsinchu County, Taiwan), Hui-Jung Tsai (Hsinchu, Taiwan), Hung-Yi Kuo (Taipei, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Ming-Hung Tseng (Miaoli County, Taiwan), Yen-Liang Lin (Taichung, Taiwan), Chun-Ti Lu (Hsinchu, Taiwan) and Chung-Ming Weng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure including a first semiconductor die, a second semiconductor die, first conductiv...