US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 29 for "Method for processing semiconductor wafer" (Taiwanese Inventor)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,076, issued on July 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method for processing semiconductor wafer" was invented by Katherine Chiang (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods for processing a semiconductor wafer are provided. A plurality of patches are extracted from the query image related to the semiconductor wafer. The patches are encoded with a set of weightings to obtain an encoding matrix. The database is searched based on the encoding matrix to retrieve the images corresponding to the query image. The retrieved images is used to inspect of defects of the semic...