US Patent Issued to Taiwan Semiconductor Manufacturing on July 29 for "Method for evaluating non-uniform stress" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,588, issued on July 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method for evaluating non-uniform stress" was invented by Wei-De Ho (Hsinchu, Taiwan), Han-Wei Wu (Hsinchu, Taiwan), Pei-Sheng Tang (Hsinchu, Taiwan), Meng-Jung Lee (Hsinchu, Taiwan), Hua-Tai Lin (Hsinchu, Taiwan), Szu-Ping Tung (Hsinchu, Taiwan) and Lan-Hsin Chiang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for evaluation of thin film non-uniform stress using high order wafer warpage, the steps including measuring a net wafer warpage across a wafer area due to thin film deposition, fitting a two dimensional low-order...