US Patent Issued to Taiwan Semiconductor Manufacturing on July 29 for "Low-refractivity grid structure and method forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,376,403, issued on July 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Low-refractivity grid structure and method forming same" was invented by Kun-Huei Lin (Tainan, Taiwan), Yun-Wei Cheng (Taipei, Taiwan), Chun-Hao Chou (Tainan, Taiwan), Kuo-Cheng Lee (Tainan, Taiwan) and Cheng Yuan Wang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming image sensors in a semiconductor substrate, thinning the semiconductor substrate from a backside of the semiconductor substrate, forming a dielectric layer on the backside of the semiconductor substrate, and forming a polymer grid on the backsid...