US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 29 for "Chip package structure with ring dam" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,561, issued on July 29, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Chip package structure with ring dam" was invented by Yu-Sheng Lin (Zhubei, Taiwan), Po-Yao Lin (Hsinchu County, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Chin-Hua Wang (New Taipei, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a chip package over the wiring substrate. The chip package structure includes a first heat conductive structure over the chip package. The chip pack...