US Patent Issued to Taiwan Semiconductor Manufacturing on July 29 for "Bonded wafer device structure and methods for making the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,658, issued on July 29, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Bonded wafer device structure and methods for making the same" was invented by Harry-Hak-Lay Chuang (Zhubei, Taiwan), Wei-Cheng Wu (Zhubei, Taiwan) and Wen-Tuo Huang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Bonded wafer device structures, such as a wafer-on-wafer (WoW) structures, and methods of fabricating bonded wafer device structures, including an array of contact pads formed in an interconnect level of at least one wafer of the bonded wafer device structure. The array of contact pads formed in an interconnect level of at...