ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,063, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Wafer taping apparatus and method" was invented by Chien-Yi Lee (Hsinchu, Taiwan) and Wen-Kuei Liu (Xinpu Township, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Wafer taping apparatuses and methods are provided for determining whether taping defects are present on a semiconductor wafer, based on image information acquired by an imaging device. In some embodiments, a method includes applying an adhesive tape on a surface of a semiconductor wafer. An imaging device acquires image information associated with the adhesive tape on the semicond...