US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Temperature controllable bonder equipment for substrate bonding" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,129, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Temperature controllable bonder equipment for substrate bonding" was invented by Han-De Chen (Hsinchu, Taiwan), Yun-Chen Teng (Hsinchu, Taiwan), Chen-Fong Tsai (Hsinchu, Taiwan), Jyh-Cherng Sheu (Hsinchu, Taiwan), Huicheng Chang (Hsinchu, Taiwan) and Yee-Chia Yeo (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a substrate bonding apparatus capable of temperature monitoring and temperature control. The substrate bonding apparatus comprises a fluid cooling module and a sensor module for detecting tempe...