US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "System and method for correcting non-ideal wafer topography" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,066, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"System and method for correcting non-ideal wafer topography" was invented by Cheng-Mu Lin (Hsin-Chu, Taiwan), Chi-Hung Liao (Sanchong, Taiwan), Yi-Ming Dai (Hsinchu, Taiwan) and Yueh Lin Yang (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A scanner includes a light source configured to apply a light to a backside of a wafer. The light is reflected from the backside of the wafer. A first mirror is configured to receive the light from the backside of the wafer and reflect the light. A sensor is configured to receive the light from ...