US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Structures for providing electrical isolation in semiconductor devices" (American, Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,139, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Structures for providing electrical isolation in semiconductor devices" was invented by Chan-Hong Chern (Palo Alto, Calif.) and Mark Chen (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor package structures are provided. An interposer is bonded to a printed circuit board (PCB) or package substrate through first solder bumps disposed on a first side of the interposer. The first solder bumps have a first pitch. A plurality of semiconductor chips are formed, and each of the semiconductor chips is bonded to a second ...