US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Semiconductor structure having photonic die and electronic die" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,147, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure having photonic die and electronic die" was invented by Hsien-Wei Chen (Hsinchu, Taiwan) and Ming-Fa Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes an encapsulated die including an electronic die and an insulating layer laterally covering the electronic die, and a photonic die coupled to the encapsulated die. The photonic die includes an optical device in proximity to an edge coupling facet of the photonic die. In a top-down view, a boundary of the electronic die is ...