US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Semiconductor devices and methods of manufacturing" (Taiwanese Inventor)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,060, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor devices and methods of manufacturing" was invented by Jhon Jhy Liaw (Zhudong Township, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices and their manufacturing methods are disclosed herein, and more particularly to semiconductor devices including a transistor having gate all around (GAA) transistor structures and manufacturing methods thereof. Different thickness in an epi-growth scheme is adopted to create different sheet thicknesses within the same device channel regions for use in manufacturing verticall...