US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 22 for "Semiconductor device package having warpage control and method of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,114, issued on July 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device package having warpage control and method of forming the same" was invented by Shu-Shen Yeh (Taoyuan, Taiwan), Che-Chia Yang (Taipei, Taiwan), Chia-Kuei Hsu (Hsinchu, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Po-Yao Lin (Zhudong Township, Hsinchu County, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package and a method of forming the same are provided. The semiconductor device package includes a substrate, an electronic component, a ring structure, and an ...