US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewall" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,127, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor chip package having underfill material surrounding a fan-out package and contacting a stress buffer structure sidewall" was invented by Po-Chen Lai (Hsinchu, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan), Shu-Shen Yeh (Taoyuan, Taiwan), Po-Yao Lin (Zhudong Township, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A fan-out package includes at least one semiconductor die attached to an interposer structure. a molding compound die frame laterally surrounding the at least one semiconductor di...