US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Package structure including stacked pillar portions and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,123, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure including stacked pillar portions and method for fabricating the same" was invented by Jung-Hua Chang (Hsinchu, Taiwan), Szu-Wei Lu (Hsinchu, Taiwan) and Ying-Ching Shih (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure including an integrated circuit die and conductive bumps is provided. The integrated circuit die includes bump pads. The conductive bumps are disposed on the bump pads. Each of the conductive bumps includes a first pillar portion disposed on one of the bump pads and a second...