ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,086, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package structure having thermoelectric cooler" was invented by Chao-Wei Chiu (Hsinchu, Taiwan), Chao-Wei Li (Hsinchu, Taiwan), Hsiu-Jen Lin (Hsinchu County, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a package structure including a first redistribution layer (RDL) structure, a die, a circuit substrate, and a first thermoelectric cooler. The RDL) structure has a first side and a second side opposite to each other. The die is disposed on the first side of the first RDL structure. The circ...