US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,084, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and manufacturing method thereof" was invented by Chih-Hao Chen (Taipei, Taiwan), Po-Yuan Cheng (Hsinchu, Taiwan), Pu Wang (Hsinchu, Taiwan), Li-Hui Cheng (New Taipei, Taiwan) and Szu-Wei Lu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manufacturing method of a package structure includes: forming a first package component over a temporary carrier, wherein the first package component comprises a semiconductor die encapsulated by an insulating encapsulation material that comprises a base layer and a plurality o...