US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Methods of forming semiconductor packages" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,149, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Methods of forming semiconductor packages" was invented by Hao-Jan Pei (Hsinchu, Taiwan), Hsiu-Jen Lin (Zhubei, Taiwan), Wei-Yu Chen (Taipei, Taiwan), Philip Yu-Shuan Chung (Taipei, Taiwan), Chia-Shen Cheng (Hsinchu, Taiwan), Kuei-Wei Huang (Hsinchu, Taiwan), Ching-Hua Hsieh (Hsinchu, Taiwan), Chung-Shi Liu (Hsinchu, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a firs...