US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Method for laser drilling process for an integrated circuit package" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,053, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Method for laser drilling process for an integrated circuit package" was invented by Chia-Shen Cheng (Zhubei, Taiwan), Chia-Lun Chang (Tainan, Taiwan), Hao-Jan Pei (Hsinchu, Taiwan), Hsiu-Jen Lin (Zhubei, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming an insulating layer over a package. The package has a plurality of locations where openings are subsequently formed. A first laser shot is performed, location by location, on each of the locations across the package. A first laser...