US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Memory device for reducing thermal crosstalk" (Taiwanese Inventor)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,332, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Memory device for reducing thermal crosstalk" was invented by Yuan-Tai Tseng (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an integrated chip including a first word line and a second word line adjacent to the first word line. The first word line and the second word line both extend along a first direction. A first memory cell is over the first word line and a second memory cell is over the second word line. A first bit line extends over the first memory cell, over the second memory cell, and along...