US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "IPD modules with flexible connection scheme in packaging" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,141, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"IPD modules with flexible connection scheme in packaging" was invented by Yu-Chia Lai (Zhunan Township, Taiwan), Cheng-Chieh Hsieh (Tainan, Taiwan), Tin-Hao Kuo (Hsinchu, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Chung-Shi Liu (Hsinchu, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a first package and a second package over and bonded to the first package. The first package includes a first device die, and a first encapsulant encapsulating the first device die therein. The second package in...