US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Interposer structure for semiconductor package including peripheral metal pad around alignment mark and methods of fabricating same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,109, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Interposer structure for semiconductor package including peripheral metal pad around alignment mark and methods of fabricating same" was invented by Hsien-Wei Chen (Hsinchu, Taiwan), Meng-Liang Lin (Hsinchu, Taiwan) and Shin-Puu Jeng (Po-Shan Village, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interposer for a semiconductor package and a method of fabricating an interposer including a peripheral metal pad surrounding an alignment mark. The alignment mark and the surrounding peripheral metal pad are formed on a first dielectric materi...