US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Info packages including thermal dissipation blocks" (Taiwanese, American Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,148, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Info packages including thermal dissipation blocks" was invented by Yu-Hao Chen (Hsinchu, Taiwan), Fong-Yuan Chang (Hsinchu, Taiwan), Po-Hsiang Huang (Tainan, Taiwan), Ching-Yi Lin (Hsinchu, Taiwan) and Jyh Chwen Frank Lee (Palo Alto, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die ove...