US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Hybrid integrated circuit packages" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,146, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Hybrid integrated circuit packages" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Jiun Yi Wu (Zhongli, Taiwan) and Hsing-Kuo Hsia (Jhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment device includes: a first dielectric layer; a first photonic die and a second photonic die disposed adjacent a first side of the first dielectric layer; a waveguide optically coupling the first photonic die to the second photonic die, the waveguide being disposed between the first dielectric layer and the first photonic die, and between the fir...