US Patent Issued to Taiwan Semiconductor Manufacturing on July 22 for "Electronic component and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,368,112, issued on July 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Electronic component and manufacturing method thereof" was invented by Chi-Yang Yu (Taoyuan, Taiwan), Jung-Wei Cheng (Hsinchu, Taiwan), Yu-Min Liang (Taoyuan, Taiwan) and Chien-Hsun Lee (Hsin-chu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component includes a board, an electronic device, and a stiffening structure is provided. The electronic device is disposed on the board. The stiffening structure is disposed on the board. The stiffening structure includes a ring portion corresponding the edge of the board. The st...